18238565. FILM FORMING METHOD FOR FORMING METAL FILM simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
Contents
FILM FORMING METHOD FOR FORMING METAL FILM
Organization Name
TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor(s)
Haruki Kondoh of Okazaki-shi (JP)
Keiji Kuroda of Toyota-shi (JP)
Koji Inagaki of Toyota-shi (JP)
FILM FORMING METHOD FOR FORMING METAL FILM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18238565 titled 'FILM FORMING METHOD FOR FORMING METAL FILM
Simplified Explanation
The method described in the patent application involves a process for electroplating a metal film onto a substrate in a predetermined pattern using a screen mask and an electrolyte membrane. Here are the key points of the innovation:
- Placing a substrate on a mount base
- Covering the substrate with a screen mask containing a predetermined pattern
- Pressing the substrate with an electrolyte membrane and applying fluid pressure of a plating solution
- Applying a voltage between an anode and the substrate to allow metal ions to pass through the electrolyte membrane and form a metal film on the substrate
- Including a cushion member along the outer edge portion of the substrate before pressing
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- Potential Applications
This technology can be used in the manufacturing of electronic devices, such as circuit boards and sensors, where precise metal patterning is required.
- Problems Solved
This technology solves the problem of accurately depositing metal films in specific patterns on substrates, which is crucial for various industrial applications.
- Benefits
The benefits of this technology include improved efficiency in metal plating processes, reduced material waste, and enhanced precision in metal film deposition.
- Potential Commercial Applications
This technology can be applied in industries such as electronics manufacturing, automotive, aerospace, and medical devices for producing high-quality metal patterns on substrates.
- Possible Prior Art
One possible prior art could be the use of traditional photolithography techniques for metal patterning on substrates, which may not offer the same level of precision and efficiency as the method described in the patent application.
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- Unanswered Questions
- How does this technology compare to traditional metal plating methods?
This article does not provide a direct comparison between this innovative method and traditional metal plating techniques in terms of efficiency, cost-effectiveness, and precision.
- What are the limitations of this technology in terms of substrate materials and sizes?
The article does not address any potential limitations of this technology regarding the types of substrates that can be used or the sizes of substrates that can be processed.
Original Abstract Submitted
The method includes: placing a substrate on a mount base; covering the substrate with the screen mask including a penetrating portion of a predetermined pattern; pressing the substrate by the electrolyte membrane with a fluid pressure of a plating solution contacting the electrolyte membrane via the screen mask; and applying a voltage between an anode contacting the plating solution and the substrate so as to allow metal ions contained in the plating solution to pass through the electrolyte membrane and form a metal film derived from the metal ions in the predetermined pattern on the substrate. The substrate includes an outer edge portion formed by an opposite surface facing the screen mask and a side surface. A cushion member is disposed along the outer edge portion before pressing the substrate.
