18237209. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18237209 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a package substrate, a first semiconductor chip, and an encapsulant surrounding the semiconductor chip. The first semiconductor chip has a semiconductor substrate with an active surface and an inactive surface, and is placed on the package substrate with the active surface facing it. The package also includes a first redistribution structure on the encapsulant, which consists of a thermally conductive pattern, a heat-conducting through via, and a redistribution insulating layer.
- The semiconductor package has a first semiconductor chip with a semiconductor substrate.
- The package substrate supports the semiconductor chip.
- The first redistribution structure on the encapsulant includes a thermally conductive pattern.
- A heat-conducting through via allows heat to conduct from the semiconductor substrate to the thermally conductive pattern.
- A redistribution insulating layer surrounds the heat-conducting through via.
Potential Applications
- This technology can be used in various electronic devices such as smartphones, laptops, and tablets. - It can also be applied in automotive electronics, industrial equipment, and medical devices.
Problems Solved
- Helps in efficient heat dissipation from the semiconductor chip. - Improves the overall performance and reliability of the semiconductor package. - Reduces the risk of overheating and potential damage to the semiconductor chip.
Benefits
- Enhanced thermal management capabilities. - Increased longevity of electronic devices. - Improved functionality and stability of semiconductor packages.
Original Abstract Submitted
A semiconductor package includes a package substrate, a first semiconductor chip, and an encapsulant surrounding the semiconductor chip. The first semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite to the active surface, the semiconductor chip disposed on the package substrate such that the active surface faces the package substrate. The semiconductor package further includes a first redistribution structure on the encapsulant. The first redistribution structure includes a thermally conductive pattern, a heat-conducting through via providing a path for heat to conduct from the semiconductor substrate to the thermally conductive pattern, and a redistribution insulating layer surrounding the heat-conducting through via. The semiconductor substrate includes a first contact region having a higher temperature than a surrounding area on the inactive surface, and the heat-conducting through via passes through the encapsulant and contacts the first contact region.
