18236537. SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
Organization Name
Inventor(s)
Tae Soon Kang of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18236537 titled 'SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
Simplified Explanation
The method described in the patent application involves manufacturing a semiconductor device by processing two substrates in separate chambers within a substrate processing apparatus.
- Two substrates, a first and a second, are loaded into the substrate processing apparatus.
- The first substrate is loaded into a first chamber, while the second substrate is loaded into a second chamber connected to the first chamber.
- Each chamber is supplied with a processing solution through dedicated pipes - a first pipe for the first chamber and a second pipe for the second chamber.
- A temperature adjusting pipe surrounds at least a part of the first pipe to regulate the temperature of the processing solution in the first chamber.
- The first pipe is shorter in length compared to the second pipe.
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- Potential Applications
- Semiconductor manufacturing industry
- Electronics manufacturing
- Problems Solved
- Efficient processing of multiple substrates simultaneously
- Temperature control of processing solutions
- Benefits
- Increased productivity in semiconductor manufacturing
- Improved quality and consistency of semiconductor devices
- Energy efficiency in processing solutions temperature control
Original Abstract Submitted
A method of manufacturing a semiconductor device may comprise loading a first substrate and a second substrate into a substrate processing apparatus, wherein the first substrate is loaded into a first chamber and the second substrate is loaded into a second chamber on the first chamber, and processing the loaded first substrate and the loaded second substrate, wherein the substrate processing apparatus comprises, the first and second chambers, a first pipe through which a first processing solution supplied to the first chamber to process the first substrate is moved, a second pipe through which a second processing solution supplied to the second chamber to process the second substrate is moved, and a temperature adjusting pipe configured to surround at least a part of the first pipe, through which the temperature adjusting solution adjusting a temperature of the first processing solution is moved, wherein a length of the first pipe is shorter than a length of the second pipe.
