18235596. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18235596 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a package substrate with ball pads, wiring lines, and solder mask layers, as well as a semiconductor chip and connection bumps. The connection bumps cover exposed surfaces of the pads and solder mask layers, providing a secure connection between the chip and the package substrate.
- Package substrate with ball pads, wiring lines, and solder mask layers
- Semiconductor chip mounted on the package substrate
- Connection bumps on the ball pads connecting to the pads on the substrate
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and reliable semiconductor packaging.
Problems Solved
This technology solves the problem of ensuring a secure and reliable connection between the semiconductor chip and the package substrate, reducing the risk of damage or malfunction in electronic devices.
Benefits
The benefits of this technology include improved performance and reliability of electronic devices, as well as potentially reducing manufacturing costs by streamlining the packaging process.
Potential Commercial Applications
The technology could be applied in the manufacturing of a wide range of electronic devices, making it a valuable innovation for semiconductor packaging companies looking to improve the quality and efficiency of their products.
Possible Prior Art
One possible prior art for this technology could be the use of connection bumps in semiconductor packaging to establish electrical connections between chips and substrates. Older methods may have involved different materials or designs for the connection bumps, but the basic concept of using bumps for connections is not new.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of reliability and performance?
The article does not provide a direct comparison between this technology and existing semiconductor packaging methods in terms of reliability and performance. It would be helpful to have more information on how this innovation improves upon or differs from current practices in the industry.
What are the potential challenges or limitations of implementing this technology in mass production?
The article does not address the potential challenges or limitations of implementing this technology in mass production. It would be important to consider factors such as cost, scalability, and compatibility with existing manufacturing processes when evaluating the feasibility of widespread adoption.
Original Abstract Submitted
A semiconductor package includes a package substrate including a ball pad with first and second pads, a wiring line extending between the first and second pads, and a solder mask layer including a first opening exposing a portion of the first pad and a second opening exposing a portion of the second pad, and a semiconductor chip on an upper surface of the package substrate, and a connection bump on a lower surface of the ball pad and connected to the first and second pads. The connection bump covers a lower surface and a first side surface of the first pad exposed through the first opening, a lower surface and side surfaces of a region of the solder mask layer covering the wiring line, and a lower surface and a first side surface of the second pad exposed through the second opening.
