18234609. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional semiconductor packaging methods?
- 1.11 What are the potential challenges in implementing this technology on a large scale?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18234609 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor structure with a lower through structure, a connection structure, and a second semiconductor structure with an upper through structure. The connection structure consists of lower and upper curved pads, with the upper curved pad connected to the upper through structure.
- The semiconductor package includes a first semiconductor structure with a lower through structure.
- The connection structure features lower and upper curved pads.
- The second semiconductor structure has an upper through structure connected to the upper curved pad.
Potential Applications
The technology described in this patent application could be applied in the manufacturing of advanced semiconductor devices, such as microprocessors, memory chips, and sensors.
Problems Solved
This technology helps in improving the performance and reliability of semiconductor packages by providing a robust connection structure between different semiconductor structures.
Benefits
The benefits of this technology include enhanced electrical connectivity, improved thermal management, and increased overall durability of semiconductor packages.
Potential Commercial Applications
The potential commercial applications of this technology could be in the fields of consumer electronics, automotive electronics, telecommunications, and industrial automation.
Possible Prior Art
One possible prior art for this technology could be the use of similar connection structures in existing semiconductor packages to improve electrical performance and reliability.
Unanswered Questions
How does this technology compare to traditional semiconductor packaging methods?
This article does not provide a direct comparison between this technology and traditional semiconductor packaging methods. It would be interesting to know the specific advantages and disadvantages of this innovation compared to existing methods.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential challenges that may arise when implementing this technology on a large scale. Understanding the scalability and practicality of this innovation would be crucial for its widespread adoption in the semiconductor industry.
Original Abstract Submitted
A semiconductor package includes a first semiconductor structure including a first semiconductor substrate and a lower through structure that penetrates the first semiconductor substrate, a connection structure on the first semiconductor structure and a second semiconductor structure on the connection structure, the second semiconductor structure including a second semiconductor substrate and an upper through structure that penetrates the second semiconductor substrate, where the connection structure includes a lower curved pad on the lower through structure, and an upper curved pad on the lower curved pad, where a top surface of the lower curved pad includes a curved surface, where a bottom surface of the upper curved pad includes a curved surface, and where the upper curved pad is connected to the upper through structure.
