18230825. BONDING APPARATUS simplified abstract (Samsung Display Co., Ltd.)
Contents
- 1 BONDING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
BONDING APPARATUS
Organization Name
Inventor(s)
FUTOSHI Yoshida of Yongin-si (KR)
JONGHYUP Kim of Yongin-si (KR)
JINPYUNG Lee of Yongin-si (KR)
DONGHYUN Han of Yongin-si (KR)
BONDING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18230825 titled 'BONDING APPARATUS
Simplified Explanation
The bonding apparatus described in the patent application includes a chamber with a light transmission part that transmits light onto a substrate where at least one chip is located, and a light generation part that irradiates the light. The light transmission part features an absorption prevention layer with through-holes and a light diffusion layer that diffuses the light passing through the through-holes to reduce heat generation and evenly irradiate the light onto the substrate.
- Chamber with light transmission part and light generation part
- Light transmission part with absorption prevention layer and light diffusion layer
Potential Applications
The technology could be applied in semiconductor manufacturing, LED production, and other industries where precise bonding of chips or components is required.
Problems Solved
1. Heat generation in the light transmission part is reduced, improving efficiency and reliability. 2. The light is uniformly irradiated onto the substrate, ensuring consistent bonding quality.
Benefits
1. Enhanced bonding process efficiency 2. Improved bonding quality and reliability 3. Reduced heat generation
Potential Commercial Applications
Optimizing semiconductor manufacturing processes Improving LED production efficiency Enhancing bonding quality in electronic component assembly
Possible Prior Art
Prior art may include bonding apparatus with light transmission parts, but the specific design with an absorption prevention layer and light diffusion layer may be novel.
Unanswered Questions
How does the light diffusion layer impact the overall performance of the bonding apparatus?
The article does not delve into the specific effects of the light diffusion layer on the bonding process efficiency or quality.
Are there any limitations to the size or type of chips that can be bonded using this apparatus?
The patent abstract does not address any potential restrictions on the size or type of chips that can be effectively bonded with this technology.
Original Abstract Submitted
A bonding apparatus includes: a chamber including a light transmission part configured to transmit light irradiated onto a substrate on which at least one chip is disposed; and a light generation part disposed on the chamber and configured to irradiate the light. The light transmission part may include an absorption prevention layer, in which a plurality of through-holes are defined, and a light diffusion layer that diffuses the light passing through the plurality of through-holes to reduce heat generation in the light transmission part and uniformly irradiate the light passing through the light transmission part onto the substrate on which at least one chip is disposed.
