18227697. SOLDER BALL ATTACHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SOLDER BALL ATTACHING APPARATUS
Organization Name
Inventor(s)
Youngjin Jang of Suwon-si (KR)
SOLDER BALL ATTACHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18227697 titled 'SOLDER BALL ATTACHING APPARATUS
Simplified Explanation
- Solder ball attaching apparatus with working die in vacuum state and movable lifting members - Upper plate on working die with insertion and locking grooves for lifting members - Lifting member lowered by chip, raised by elastic restoring force
Potential Applications
- Semiconductor manufacturing - Electronics assembly
Problems Solved
- Ensures precise placement of solder balls - Facilitates efficient soldering process
Benefits
- Improved accuracy and consistency in solder ball attachment - Increased productivity in manufacturing processes
Original Abstract Submitted
A solder ball attaching apparatus includes a working die, having an internal space maintained in a vacuum state, and a plurality of lifting members installed on the working die to be movable upwardly and downwardly. The working die may be provided with an upper plate on which the lifting members are installed. The upper plate may be provided with an insertion groove, into which an upper end portion of the lifting member is inserted when the lifting member is lowered, and a locking groove into which a lower end portion of the lifting member is inserted when the lifting member is raised. The lifting member may be lowered by a chip when the chip is seated on the lifting member and may be raised by elastic restoring force when the chip is removed.
