18226644. ION BEAM DEPOSITION APPARATUS AND ION BEAM DEPOSITION METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
ION BEAM DEPOSITION APPARATUS AND ION BEAM DEPOSITION METHOD USING THE SAME
Organization Name
Inventor(s)
Jeongyeon Lee of Suwon-si (KR)
Dong-Chan Lim of Suwon-si (KR)
ION BEAM DEPOSITION APPARATUS AND ION BEAM DEPOSITION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226644 titled 'ION BEAM DEPOSITION APPARATUS AND ION BEAM DEPOSITION METHOD USING THE SAME
Simplified Explanation
The patent application describes a method for ion beam deposition, involving the irradiation of an ion beam towards a target plate while rotating the plate, which contains different materials in different regions.
- Ion beam deposition method
- Substrate placed in apparatus
- Ion beam irradiated towards target plate
- Target plate rotated during irradiation
- Target plate has regions with different materials
Potential Applications
- Thin film deposition for electronic devices
- Coating for optical components
- Surface modification for biomedical implants
Problems Solved
- Uniform coating deposition
- Enhanced adhesion of coatings
- Control over material composition
Benefits
- Improved coating quality
- Enhanced material properties
- Increased efficiency in deposition process
Original Abstract Submitted
An ion beam deposition method includes placing a substrate into an ion beam deposition apparatus, irradiating an ion beam from an ion beam source toward a target plate, and rotating the target plate during the irradiating of the ion beam. The target plate includes a first region that includes a first material, and a second region that includes a second material different from the first material.
