18218885. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sangseok Hong of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18218885 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a fan-out semiconductor package with various structures and layers for redistribution and wiring.
- The package includes a wiring substrate with first fan-in, fan-out, and second fan-in regions.
- It also includes first and second fan-in chip structures, first redistribution elements on the bottom surface, and a second redistribution structure on the top surface.
- The second redistribution structure extends to the first fan-in and fan-out regions, with second redistribution vias and a seed layer.
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- Potential Applications
- Semiconductor packaging for electronic devices
- Integrated circuits in consumer electronics
- High-performance computing systems
- Problems Solved
- Efficient redistribution of signals in a semiconductor package
- Improved connectivity between different chip structures
- Enhanced performance and reliability of electronic devices
- Benefits
- Higher integration density
- Improved signal transmission
- Enhanced thermal performance
- Increased reliability and durability of electronic devices
Original Abstract Submitted
A fan-out semiconductor package includes a wiring substrate including a first fan-in region, a fan-out region surrounding the first fan-in region, and a second fan-in region, a first fan-in chip structure, a second fan-in chip structure, a first redistribution structure including first redistribution elements disposed on a bottom surface of the wiring substrate, and a second redistribution structure disposed on a top surface of the wiring substrate, and a chip wiring structure formed on a top surface of the second chip, and the second redistribution structure includes a second redistribution layer extending to the first fan-in region and the fan-out region, a plurality of second redistribution vias integrally formed with the second redistribution layer and extending downward, and a seed layer surrounding the second redistribution layer and bottom surfaces of the plurality of second redistribution vias.
