18217815. APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Dae-Woong Choi of Suwon-si (KR)
Yong Myung Jun of Suwon-si (KR)
Hyun-Chul Kim of Suwon-si (KR)
Chang Seok Seo of Suwon-si (KR)
Woo Seok Choe of Suwon-si (KR)
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18217815 titled 'APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The patent application describes an apparatus for manufacturing a semiconductor device. Here are the key points:
- The apparatus includes a wet treatment chamber where a treatment material is sprayed onto a substrate.
- A nozzle is provided in the wet treatment chamber to spray the treatment material onto the substrate.
- There is also a supercritical fluid treatment chamber that supplies a supercritical fluid onto the substrate to treat it.
- A transfer device with an arm is used to transfer the substrate between the wet treatment chamber and the supercritical fluid treatment chamber.
- A controller is responsible for controlling the wet treatment chamber to spray the treatment material onto the arm.
Potential applications of this technology:
- Semiconductor manufacturing: The apparatus can be used in the production of semiconductor devices, where wet treatment and supercritical fluid treatment are required for substrate preparation.
Problems solved by this technology:
- Efficient treatment: The apparatus allows for both wet treatment and supercritical fluid treatment, providing a comprehensive solution for substrate preparation in semiconductor manufacturing.
Benefits of this technology:
- Versatility: The apparatus offers the flexibility to perform both wet treatment and supercritical fluid treatment, allowing for a wider range of substrate preparation options.
- Improved control: The controller ensures precise control over the wet treatment process, optimizing the application of the treatment material onto the substrate.
- Time and cost savings: By combining wet treatment and supercritical fluid treatment in a single apparatus, the manufacturing process can be streamlined, potentially reducing time and costs.
Original Abstract Submitted
An apparatus for manufacturing a semiconductor device, including: a wet treatment chamber; a nozzle provided in the wet treatment chamber and configured to spray a treatment material onto a substrate; a supercritical fluid treatment chamber configured to supply a supercritical fluid onto the substrate to treat the substrate; a transfer device comprising an arm configured to transfer the substrate between the wet treatment chamber and the supercritical fluid treatment chamber; and a controller configured to control the wet treatment chamber to spray the treatment material onto the arm
