18216675. EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does the pressure exerted on the protrusions affect the positioning of the divided dies on the dicing tape?
- 1.9.3 What materials are used in the construction of the first expander and how does it contribute to the overall functionality of the semiconductor manufacturing equipment?
- 1.10 Original Abstract Submitted
EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME
Organization Name
Inventor(s)
Young Hun Kim of Suwon-si (KR)
EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18216675 titled 'EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME
Simplified Explanation
The semiconductor manufacturing equipment described in the patent application includes a first clamp for fixing a dicing tape with divided dies, and a first expander that can ascend and descend, with protrusions that can extend or retract based on pressure exerted on them.
- The first clamp is designed to hold a dicing tape with multiple divided dies securely in place.
- The first expander, located next to the first clamp, has protrusions that can move up and down depending on the pressure applied to them.
Potential Applications
This technology could be used in semiconductor manufacturing processes where precise control over the positioning of divided dies on a dicing tape is required.
Problems Solved
This innovation solves the problem of ensuring the accurate placement and alignment of divided dies on a dicing tape during semiconductor manufacturing.
Benefits
The benefits of this technology include improved efficiency and accuracy in the semiconductor manufacturing process, leading to higher quality end products.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for the production of integrated circuits and other electronic components.
Possible Prior Art
One possible prior art for this technology could be similar systems used in semiconductor manufacturing equipment for die handling and processing.
Unanswered Questions
How does the pressure exerted on the protrusions affect the positioning of the divided dies on the dicing tape?
The pressure applied to the protrusions determines how far they descend into the body of the expander, which in turn affects the positioning of the divided dies on the dicing tape.
What materials are used in the construction of the first expander and how does it contribute to the overall functionality of the semiconductor manufacturing equipment?
The materials used in the construction of the first expander are not specified in the abstract, but they are likely chosen for their durability and ability to withstand the pressures exerted during the manufacturing process.
Original Abstract Submitted
A semiconductor manufacturing equipment includes: a first clamp fixing a dicing tape, on which a plurality of divided dies are disposed, and configured to ascend and descend; and a first expander adjacent to the first clamp and including a body, a first protrusion connected to the body, and a second protrusion connected to the body and spaced apart from the first protrusion, wherein, when no pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion protrude from the body, and wherein, when a pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion descend into the body depending on a magnitude of the pressure exerted on the first protrusion and the second protrusion.
