18213967. TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
Organization Name
Inventor(s)
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18213967 titled 'TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
Simplified Explanation
The abstract of the patent application describes a substrate with multiple input/output regions, input and output pads, mounting regions, positive and negative pads, and connections between them.
- The substrate includes multiple input/output regions for connecting to external devices.
- Input and output pads are provided in each input/output region for signal transmission.
- Mounting regions are included for securing the substrate in place.
- Positive and negative pads are connected within the mounting regions for power distribution.
- Connections between pads ensure proper signal and power flow throughout the substrate.
Potential Applications
This technology could be applied in electronic devices, circuit boards, sensors, and other systems requiring reliable signal and power distribution.
Problems Solved
This innovation solves the problem of efficiently connecting multiple components within a substrate while ensuring proper signal and power flow.
Benefits
The benefits of this technology include improved reliability, enhanced performance, and simplified design of electronic systems.
Potential Commercial Applications
Potential commercial applications of this technology include consumer electronics, automotive systems, industrial equipment, and telecommunications devices.
Possible Prior Art
Prior art may include similar substrate designs with input/output regions, pads, and connections for signal and power distribution.
Unanswered Questions
How does this technology compare to existing substrate designs in terms of efficiency and reliability?
This technology offers improved efficiency and reliability compared to existing substrate designs by providing optimized signal and power flow paths.
What are the potential cost implications of implementing this technology in mass production?
The cost implications of mass-producing this technology may vary depending on the complexity of the substrate design and the materials used. Additional research and analysis are needed to determine the exact cost implications.
Original Abstract Submitted
A substrate includes a first input/output region; a first input pad provided in the first input/output region; a first output pad provided in the first input/output region; a first mounting region; a first positive pad provided in the first mounting region and connected to the first input pad; a first negative pad provided in the first mounting region connected to the first output pad; a second positive pad provided in the first mounting region; a second negative pad provided in the first mounting region; a second mounting region; a third positive pad provided in the second mounting region and connected to the second positive pad; a third negative pad provided in the second mounting region and connected to the second negative pad; a fourth positive pad provided in the second mounting region; a fourth negative pad provided in the second mounting region; a second input/output region; a second input pad provided in the second input/output region and connected to the fourth positive pad; and a second output pad provided in the second input/output region and connected to the fourth negative pad.
