18212453. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeon Jun Song of Suwon-si (KR)
Hyeong Mun Kang of Suwon-si (KR)
Tae Hyeong Kim of Suwon-si (KR)
Young Woo Lim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18212453 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a base substrate, a semiconductor chip placed on the base substrate, a dam structure overlapping a corner of the semiconductor chip, and a fillet layer placed vertically between the base substrate and the semiconductor chip, as well as between the dam structure and the semiconductor chip.
- The semiconductor package includes a base substrate, which provides a foundation for the other components.
- A semiconductor chip is placed on the base substrate, allowing for electronic functionality.
- A dam structure overlaps a corner of the semiconductor chip, providing additional support and protection.
- A fillet layer is placed vertically between the base substrate and the semiconductor chip, as well as between the dam structure and the semiconductor chip, enhancing the structural integrity of the package.
Potential applications of this technology:
- This semiconductor package can be used in various electronic devices, such as smartphones, computers, and automotive systems.
- It can be utilized in the manufacturing of integrated circuits and microprocessors.
Problems solved by this technology:
- The dam structure and fillet layer provide improved protection against physical damage and environmental factors.
- The package design enhances the reliability and durability of the semiconductor chip.
Benefits of this technology:
- The semiconductor package offers enhanced structural support and protection for the semiconductor chip.
- It improves the overall performance and lifespan of electronic devices.
- The design allows for efficient manufacturing processes and cost-effective production.
Original Abstract Submitted
A semiconductor package comprises a base substrate, a first semiconductor chip on the base substrate, a first dam structure which overlaps a corner of the first semiconductor chip from a plan view and is placed on the base substrate and a first fillet layer which is placed vertically between the base substrate and the first semiconductor chip, and vertically between the first dam structure and the first semiconductor chip.
