18204459. WAFER HEATING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
WAFER HEATING APPARATUS
Organization Name
Inventor(s)
Youngjae Jeon of Suwon-si (KR)
WAFER HEATING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18204459 titled 'WAFER HEATING APPARATUS
Simplified Explanation
- Wafer heating apparatus with a heating chamber and heating lamp - Heating lamp includes multiple circular band-shaped lamps with open regions - At least one lamp is placed in regions adjacent to the open regions of the other lamps
Potential Applications
- Semiconductor manufacturing - Solar cell production - Thin film deposition processes
Problems Solved
- Uniform heating of wafers - Efficient heating process - Reduced energy consumption
Benefits
- Improved wafer processing - Enhanced productivity - Cost-effective heating solution
Original Abstract Submitted
A wafer heating apparatus may include a heating chamber having an internal space and a heating lamp disposed in the internal space of the heating chamber. The heating lamp may be configured to heat a wafer. The heating lamp may include a plurality of lamps. Each of the plurality of lamps may have circular band shapes with open regions. At least one lamp may be disposed in at least one region among regions adjacent to the open regions of the plurality of lamps.