18204459. WAFER HEATING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)

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WAFER HEATING APPARATUS

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Joohee Kim of Suwon-si (KR)

Youngjae Jeon of Suwon-si (KR)

Jaehyun Cho of Suwon-si (KR)

Yihwan Kim of Suwon-si (KR)

Sangmin Lee of Suwon-si (KR)

WAFER HEATING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18204459 titled 'WAFER HEATING APPARATUS

Simplified Explanation

- Wafer heating apparatus with a heating chamber and heating lamp - Heating lamp includes multiple circular band-shaped lamps with open regions - At least one lamp is placed in regions adjacent to the open regions of the other lamps

Potential Applications

- Semiconductor manufacturing - Solar cell production - Thin film deposition processes

Problems Solved

- Uniform heating of wafers - Efficient heating process - Reduced energy consumption

Benefits

- Improved wafer processing - Enhanced productivity - Cost-effective heating solution


Original Abstract Submitted

A wafer heating apparatus may include a heating chamber having an internal space and a heating lamp disposed in the internal space of the heating chamber. The heating lamp may be configured to heat a wafer. The heating lamp may include a plurality of lamps. Each of the plurality of lamps may have circular band shapes with open regions. At least one lamp may be disposed in at least one region among regions adjacent to the open regions of the plurality of lamps.