18204161. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEUNGWAN Shin of Suwon-si (KR)
JUNGHOON Kang of Suwon-si (KR)
JUNG HYUN Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18204161 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a molding material encapsulating the chip and substrate, and a second redistribution substrate on top of the molding material. The second redistribution substrate features at least one redistribution line, a metal pad, and a dielectric layer covering the redistribution line and metal pad, with a marking region on the metal pad and multiple concave portions on the metal pad.
- The semiconductor package consists of multiple layers, including redistribution substrates, a semiconductor chip, molding material, and a second redistribution substrate.
- The second redistribution substrate contains essential components such as redistribution lines, metal pads, and a dielectric layer with specific features like a marking region and concave portions.
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics manufacturing, semiconductor packaging, and integrated circuit design.
Problems Solved
This innovation addresses issues related to semiconductor packaging, such as improving signal transmission, enhancing electrical connections, and providing efficient heat dissipation for the semiconductor chip.
Benefits
The benefits of this technology include increased reliability of semiconductor packages, improved performance of electronic devices, and enhanced durability of integrated circuits.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced electronic devices with high-speed processing capabilities and improved thermal management.
Possible Prior Art
One possible prior art related to this technology could be the use of redistribution substrates in semiconductor packaging to enhance electrical connections and signal transmission.
Unanswered Questions
1. How does the presence of concave portions on the metal pad impact the overall performance of the semiconductor package? 2. What specific materials are used in the dielectric layer to ensure proper insulation and protection of the redistribution lines and metal pads?
Original Abstract Submitted
A semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding material molding the semiconductor chip and the first redistribution substrate; and a second redistribution substrate provided on the molding material, wherein the second redistribution substrate includes: at least one redistribution line; a metal pad; and a dielectric layer molding the at least one redistribution line and the metal pad, wherein the dielectric layer includes a marking region on the metal pad, and the metal pad includes a plurality of concave portions.
