18203677. IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GATE ELECTRODES simplified abstract (Samsung Electronics Co., Ltd.)
IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GATE ELECTRODES
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IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GATE ELECTRODES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18203677 titled 'IMAGE SENSOR INCLUDING LANDING STRUCTURE HAVING SAME MATERIAL AS GATE ELECTRODES
Simplified Explanation
The patent application describes an image sensor with a lower substrate, lower circuit devices, lower wiring structure, lower bonding pad, lower bonding via, landing structure, upper bonding pad, and upper substrate with photoelectric conversion devices.
- Lower substrate with circuit devices and wiring structure
- Lower bonding pad and bonding via for electrical connection
- Landing structure contacting lower bonding via
- Upper bonding pad bonded to lower bonding pad
- Upper substrate with photoelectric conversion devices
- Landing structure overlapping lower circuit devices horizontally
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- Potential Applications
- Digital cameras
- Smartphones
- Surveillance cameras
- Medical imaging devices
- Problems Solved
- Improved electrical connection between components
- Enhanced image quality and resolution
- Increased sensitivity to light
- Benefits
- Higher quality images
- Improved performance in low light conditions
- Compact design for portable devices
Original Abstract Submitted
An image sensor includes a lower substrate having a first surface and a second surface opposing the first surface, lower circuit devices disposed on the first surface, a lower wiring structure electrically connected to the lower circuit devices on the first surface, a lower bonding pad on the second surface, a lower bonding via penetrating through the lower substrate between the lower bonding pad and the lower wiring structure, a landing structure disposed on the first surface and contacting the lower bonding via, an upper bonding pad bonded to the lower bonding pad on the lower bonding pad, and an upper substrate disposed on the upper bonding pad and including photoelectric conversion devices. At least a portion of the landing structure horizontally overlaps the lower circuit devices.
