SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

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SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18202128 titled 'SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

Simplified Explanation

The patent application describes a solder reflow system that includes a solder reflow apparatus, a condensation apparatus, and a cleaning apparatus. The system is designed to reflow solder on a semiconductor package, condensate gas generated during the process, and clean the package without mixing the heat transfer fluid with the cleaning agent.

Solder reflow system components:

   - Solder reflow apparatus: Reflows solder using heat transfer fluid.
   - Condensation apparatus: Condensates gas from heat transfer fluid.
   - Cleaning apparatus: Cleans semiconductor package using cleaning agent.

Process:

   - Solder reflow apparatus reflows solder on semiconductor package.
   - Condensation apparatus condensates gas from heat transfer fluid.
   - Cleaning apparatus cleans semiconductor package without mixing heat transfer fluid with cleaning agent.

Benefits:

   - Efficient removal of heat transfer fluid from semiconductor package.
   - Prevents contamination of cleaning agent with heat transfer fluid.
   - Maintains cleaning capacity of cleaning agent.

Potential Applications

The technology can be applied in semiconductor manufacturing processes where solder reflow and cleaning of packages are required.

Problems Solved

1. Contamination of cleaning agent with heat transfer fluid. 2. Efficient removal of heat transfer fluid from semiconductor packages.

Benefits

1. Improved cleaning efficiency. 2. Reduced risk of contamination. 3. Enhanced semiconductor package quality.

Potential Commercial Applications

"Semiconductor Package Cleaning System for Efficient Solder Reflow and Cleaning Process"

Possible Prior Art

No prior art information available.

Unanswered Questions

How does the system handle different sizes of semiconductor packages?

The patent application does not specify if the system is adaptable to various sizes of semiconductor packages. It would be important to know if the system can accommodate different package dimensions without compromising efficiency.

What is the maintenance schedule for the system components?

The patent application does not mention the maintenance requirements or schedule for the solder reflow, condensation, and cleaning apparatus. Understanding the maintenance needs of the system is crucial for its long-term performance and reliability.

Original Abstract Submitted

A solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. The solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. The condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. The condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. The cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. Thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. As a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.

18202128. SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Contents

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

Organization Name

Inventor(s)