18200619. APPARATUS FOR CLEANING WAFER simplified abstract (Samsung Electronics Co., Ltd.)

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APPARATUS FOR CLEANING WAFER

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Hyojin Park of Suwon-si (KR)

Songyun Kang of Suwon-si (KR)

Sungyong Park of Suwon-si (KR)

Kiseok Lee of Suwon-si (KR)

APPARATUS FOR CLEANING WAFER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18200619 titled 'APPARATUS FOR CLEANING WAFER

Simplified Explanation

The wafer cleaning apparatus described in the patent application includes a base, a roller installation table, a wafer support unit, a pressing roller, and a driving unit.

  • The base provides a stable platform for the apparatus.
  • The roller installation table is installed on the base and serves as a support for the other components.
  • The wafer support unit is located on the roller installation table and includes a support roller that rotates to support the edge of a wafer.
  • The pressing roller is installed above the wafer support unit and is designed to press the surfaces of the wafer.
  • The driving unit applies a force in a direction perpendicular to the central axis of the pressing roller, causing it to deform.
  • The deformed pressing roller applies different pressures to the central portion and the edge portion of the wafer.

Potential applications of this technology:

  • Semiconductor manufacturing: The wafer cleaning apparatus can be used in the production of semiconductor devices to clean wafers before further processing.
  • Electronics manufacturing: The apparatus can also be applied in the manufacturing of various electronic components that require clean wafers as a starting material.

Problems solved by this technology:

  • Efficient cleaning: The apparatus provides a method for effectively cleaning wafers by applying different pressures to different areas, ensuring thorough removal of contaminants.
  • Uniform pressure distribution: By deforming the pressing roller, the apparatus achieves a more uniform pressure distribution across the wafer, preventing damage or uneven cleaning.

Benefits of this technology:

  • Improved cleaning quality: The ability to apply different pressures to different areas of the wafer ensures a more thorough and efficient cleaning process.
  • Reduced damage risk: The uniform pressure distribution achieved by the deformed pressing roller minimizes the risk of damage to the wafer during cleaning.
  • Increased productivity: The wafer cleaning apparatus allows for faster and more effective cleaning, leading to increased productivity in semiconductor and electronics manufacturing.


Original Abstract Submitted

A wafer cleaning apparatus includes a base, a roller installation table installed on the base, a wafer support unit disposed at the roller installation table and having a support roller for rotatably supporting an edge of a wafer, a pressing roller installed on the roller installation table and above the wafer support unit, and configured to press opposite surfaces of the wafer, and a driving unit providing a force in a direction, crossing a direction of a central axis of the pressing roller, so that a shape of the pressing roller is deformed. The pressing roller deformed by the driving unit applies a first pressure to a central portion of the wafer and a second pressure, different from the first pressure, to an edge portion of the water.

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