18200068. CHIP EJECTOR simplified abstract (Samsung Electronics Co., Ltd.)
Contents
CHIP EJECTOR
Organization Name
Inventor(s)
CHIP EJECTOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18200068 titled 'CHIP EJECTOR
Simplified Explanation
The patent application describes a chip ejector with a pushing mechanism that can easily delaminate a semiconductor chip from a film using vacuum technology.
- Ejector body with vacuum holes and opening
- Pushing mechanism to lift semiconductor chip
- Vacuum technology used to fix chip to film
- Strong downward force applied to delaminate chip
Potential Applications
This technology could be used in semiconductor manufacturing processes where delicate chips need to be separated from films without damage.
Problems Solved
This technology solves the problem of safely and efficiently removing semiconductor chips from films without causing damage or delamination issues.
Benefits
The benefits of this technology include increased efficiency in chip removal processes, reduced risk of damage to delicate chips, and improved overall quality of semiconductor manufacturing.
Potential Commercial Applications
Potential commercial applications for this technology include semiconductor manufacturing companies, electronics manufacturers, and any industry that requires precise handling of semiconductor chips.
Possible Prior Art
One possible prior art for this technology could be existing chip ejectors with vacuum technology, but with less efficient delamination processes.
Unanswered Questions
How does this technology compare to traditional chip ejectors in terms of efficiency and effectiveness?
This technology offers a more efficient and effective way to delaminate semiconductor chips from films compared to traditional methods, as it uses vacuum technology to securely fix the chip and apply a strong downward force for delamination.
What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?
The implementation of this technology may involve initial costs for acquiring and integrating the chip ejector system, but the long-term benefits of improved efficiency and reduced chip damage could outweigh the initial investment.
Original Abstract Submitted
A chip ejector may include an ejector body and a pushing mechanism, the ejector body may include first vacuum holes, an opening and at least one second vacuum hole, the first vacuum holes may fix a film having at least one semiconductor chip using a vacuum, the opening may be formed under the semiconductor chip, the second vacuum hole may be arranged around the opening to provide a portion of the film under an edge portion of a lower surface of the semiconductor chip with the vacuum, the pushing mechanism may be lifted in the ejector body through the opening to lift up the semiconductor chip and the film, thus, a sufficiently strong downward force may be applied to the portion of the film under the edge portion of the lower surface of the semiconductor chip to readily delaminate the semiconductor chip having a thin thickness from the film.
