18190917. PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chieh-Hsin Hsieh of Hsinchu County (TW)

Wei-Han Lai of New Taipei City (TW)

Ching-Yu Chang of Yilang County (TW)

PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18190917 titled 'PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Simplified Explanation

The photoresist described in the patent application consists of a solvent, a polymer, and an additive. The polymer is dissolved in the solvent, while the additive is dispersed in the solvent. The additive contains a double bond or an epoxy group and has a surface tension different from that of the polymer.

  • The photoresist includes a solvent, a polymer, and an additive.
  • The polymer is dissolved in the solvent.
  • The additive is dispersed in the solvent.
  • The additive contains a double bond or an epoxy group.
  • The additive has a surface tension different from the polymer.

Potential Applications

The technology described in the patent application could be applied in the semiconductor industry for photolithography processes.

Problems Solved

This technology helps in improving the resolution and quality of patterns created during photolithography processes.

Benefits

The use of this photoresist can lead to more precise and accurate patterning in semiconductor manufacturing.

Potential Commercial Applications

Optimizing Photoresist Additives for Enhanced Semiconductor Manufacturing

Possible Prior Art

There may be existing patents or publications related to the use of additives in photoresists for semiconductor manufacturing processes.

Unanswered Questions

How does the presence of the additive affect the adhesion properties of the photoresist?

The article does not provide information on how the additive influences the adhesion of the photoresist to the substrate during the manufacturing process.

What is the environmental impact of using this type of photoresist compared to traditional formulations?

The article does not address the potential environmental implications of using this innovative photoresist technology.


Original Abstract Submitted

A photoresist includes a solvent, a polymer and an additive. The polymer is dissolved in the solvent, and the additive is dispersed in the solvent. The additive includes a double bond or includes an epoxy group. The additive has a surface tension different from a surface tension of the polymer.