18188540. PLASMA SENSOR MODULE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
PLASMA SENSOR MODULE
Organization Name
Inventor(s)
Kyunghyun Kim of Suwon-si (KR)
Dougyong Sung of Suwon-si (KR)
Younseon Wang of Suwon-si (KR)
PLASMA SENSOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18188540 titled 'PLASMA SENSOR MODULE
Simplified Explanation
The abstract describes a plasma sensor module with improved structural strength, including an upper substrate exposed to plasma, a lower substrate with a probe and a PCB for detecting plasma density.
- Upper substrate exposed to plasma
- Lower substrate in contact with lower surface of upper substrate
- Lower substrate thicker than upper substrate
- Probe located in lower substrate
- PCB in lower substrate applies alternating current to probe to detect plasma density
Potential Applications
- Plasma monitoring in industrial processes - Plasma etching in semiconductor manufacturing - Plasma cleaning in electronic device production
Problems Solved
- Fragility of traditional plasma sensor modules - Difficulty in accurately detecting plasma density - Limited durability in harsh plasma environments
Benefits
- Improved structural strength - Enhanced reliability in plasma detection - Extended lifespan in demanding plasma applications
Original Abstract Submitted
A plasma sensor module may include an upper substrate, a lower substrate, at least one probe and a printed circuit board (PCB). The upper substrate may be configured to be exposed to plasma. The lower substrate may contact a lower surface of the upper substrate. The lower substrate may have a thickness that is thicker than a thickness of the upper substrate. The probe may be in the lower substrate. The PCB may be in the lower substrate. The PCB may be configured to apply an alternating current to the probe to detect a density of the plasma. Thus, the structural strength of the plasma sensor module may have improved structural strength.
