18187444. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kwangjin Moon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18187444 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that consists of a semiconductor substrate and a semiconductor chip in contact with the substrate. The chip has a first surface facing the substrate and a second surface opposite to it. The chip also has a die region, an edge region surrounding the die region, and multiple air exhaust passages extending from the die region to the outer surface of the edge region in the first surface of the chip. Each air exhaust passage includes an inlet with a smaller passage area and an outlet with a larger passage area.
- The semiconductor package includes a semiconductor substrate and a chip in contact with it.
- The chip has a die region, an edge region, and air exhaust passages.
- The air exhaust passages extend from the die region to the outer surface of the edge region.
- Each air exhaust passage has an inlet with a smaller passage area and an outlet with a larger passage area.
Potential Applications:
- This technology can be used in various semiconductor devices such as microprocessors, memory chips, and integrated circuits.
- It can improve the thermal management of semiconductor packages, allowing for better heat dissipation and increased performance.
- The air exhaust passages can help in reducing the temperature of the semiconductor chip, preventing overheating and potential damage.
Problems Solved:
- Overheating is a common issue in semiconductor devices, which can lead to reduced performance and reliability. The air exhaust passages help in dissipating heat effectively, addressing this problem.
- By providing a pathway for air to escape from the chip, the technology prevents the buildup of hot air pockets, reducing the risk of thermal damage.
Benefits:
- Improved thermal management leads to enhanced performance and reliability of semiconductor devices.
- The technology allows for higher power densities and increased functionality in semiconductor packages.
- By preventing overheating, the lifespan of semiconductor devices can be extended, reducing the need for frequent replacements.
Original Abstract Submitted
A semiconductor package includes a semiconductor substrate and a semiconductor chip in contact with the semiconductor substrate. The semiconductor chip has a first surface facing the semiconductor substrate and an opposite second surface. The semiconductor chip has a die region, an edge region extending around the die region and a plurality of air exhaust passages extending from the die region to an outer surface of the edge region in the first surface of the semiconductor chip. Each of the air exhaust passages includes an inlet having a first passage area, and an outlet having a second passage area greater than the first passage area.
