18184386. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sung Gu Kang of Suwon-si (KR)

Jae Choon Kim of Suwon-si (KR)

Hwan Joo Park of Suwon-si (KR)

Sung-Ho Mun of Suwon-si (KR)

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18184386 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Simplified Explanation

The abstract of the patent application describes a semiconductor package with improved thermal properties. The package includes a first package with a first die, an interposer with a first area and a second area, a second package on the top face of the interposer in the second area, and a thermal diffusion structure on the top face of the interposer in the first area. The thermal diffusion structure allows heat generated in the first die to be discharged through it.

• The semiconductor package includes a first die, an interposer, and a second package.
• The interposer has a first area and a second area.
• The second package is located on the top face of the interposer in the second area.
• A thermal diffusion structure is present on the top face of the interposer in the first area.
• The thermal diffusion structure allows heat generated in the first die to be discharged through it.

Potential Applications:

• This semiconductor package can be used in various electronic devices that require efficient heat dissipation, such as computers, smartphones, and servers.
• It can be applied in high-performance computing systems, where thermal management is crucial to prevent overheating and ensure optimal performance.

Problems Solved:

• The semiconductor package addresses the issue of heat accumulation in the first die by providing a thermal diffusion structure that efficiently dissipates the heat.
• It solves the problem of thermal management in electronic devices, preventing overheating and potential damage to the components.

Benefits:

• Improved thermal properties of the semiconductor package result in better heat dissipation, leading to enhanced performance and reliability of electronic devices.
• The thermal diffusion structure allows for efficient heat transfer, reducing the risk of overheating and extending the lifespan of the semiconductor package.
• The package's design enables effective thermal management, ensuring stable operation even under high thermal loads.

Original Abstract Submitted

A semiconductor package with improved thermal properties is provided. The semiconductor package includes a first package including a first die, an interposer on the first package and including a first area and a second area. A second package is on a top face of the interposer in the second area, and a thermal diffusion structure is on a top face of the interposer in the first area. The thermal diffusion structure is configured so that heat generated in the first die is discharged through the thermal diffusion structure.