18183699. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwon-si (KR)
Kyounglim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18183699 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution wiring layer with a first surface and a second surface. It also has a conductive bump on the first surface and a first semiconductor device on the conductive bump. The redistribution wiring layer consists of redistribution wirings, an uppermost redistribution wiring, a bonding pad, and an uppermost insulating layer. The uppermost redistribution wiring has a redistribution via and a redistribution line on the redistribution via. The bonding pad is located on the redistribution line of the uppermost redistribution wiring, and the conductive bump is placed on the bonding pad. The uppermost insulating layer covers the uppermost redistribution wiring but has an opening that exposes a portion of the bonding pad.
- The semiconductor package includes a redistribution wiring layer with a conductive bump and a first semiconductor device.
- The redistribution wiring layer has redistribution wirings, an uppermost redistribution wiring, a bonding pad, and an uppermost insulating layer.
- The uppermost redistribution wiring has a redistribution via and a redistribution line.
- The bonding pad is located on the redistribution line of the uppermost redistribution wiring.
- The conductive bump is disposed on the bonding pad.
- The uppermost insulating layer covers the uppermost redistribution wiring but has an opening exposing a portion of the bonding pad.
Potential applications of this technology:
- Semiconductor packaging for electronic devices such as smartphones, tablets, and computers.
- Integrated circuits and microprocessors.
Problems solved by this technology:
- Provides a reliable and efficient method for connecting semiconductor devices within a package.
- Reduces the risk of electrical shorts and improves signal transmission.
Benefits of this technology:
- Improved performance and reliability of semiconductor packages.
- Enables smaller and more compact electronic devices.
- Reduces manufacturing costs and improves production efficiency.
Original Abstract Submitted
A semiconductor package includes a redistribution wiring layer having a first surface and a second surface opposite to the first surface, a conductive bump on the first surface, and a first semiconductor device on the conductive bump. The redistribution wiring layer includes redistribution wirings having an uppermost redistribution wiring, a bonding pad, and an uppermost insulating layer. The uppermost redistribution wiring has a redistribution via and a redistribution line on the redistribution via. The bonding pad disposes on the redistribution line of the uppermost redistribution wiring, and the conductive bump is disposed on the bonding pad. The uppermost insulating layer overlapping (e.g., covering) the uppermost redistribution wiring and having an opening exposing a portion of the bonding pad.
