18166116. BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chen-Hua Yu of Hsinchu City (TW)
Chih-Hang Tung of Hsinchu (TW)
Kuo-Chung Yee of Taoyuan City (TW)
Yian-Liang Kuo of Hsinchu City (TW)
Jiun-Yi Wu of Zhongli City (TW)
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18166116 titled 'BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY
Simplified Explanation
The bond head described in the patent application includes a chuck member with vacuum holes for holding a die using air pressure, an elastic material covering the chuck surface, and a bond base.
- The chuck member protrudes from the bond base and has a chuck surface with vacuum holes for holding a die.
- The width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die.
- The elastic material is arranged around the periphery of the chuck surface to cover edges and corners of the chuck surface.
Potential Applications
This technology could be used in semiconductor manufacturing for bonding processes.
Problems Solved
This technology solves the problem of securely holding a die in place during bonding processes.
Benefits
The benefits of this technology include improved accuracy and efficiency in bonding processes.
Potential Commercial Applications
"Enhancing Semiconductor Bonding Processes with Innovative Bond Head Technology"
Possible Prior Art
There may be prior art related to chuck members with vacuum holes for holding dies during bonding processes.
Unanswered Questions
How does the elastic material affect the bonding process?
The elastic material may provide cushioning and stability for the die during bonding, but the specific impact on the process is not detailed in the abstract.
What materials are used in the construction of the bond head?
The abstract does not specify the materials used for the bond base, chuck member, or elastic material, leaving this aspect open for further exploration.
Original Abstract Submitted
A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.
