18164748. MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
Organization Name
Inventor(s)
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18164748 titled 'MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
Simplified Explanation
The patent application describes a module board with a substrate, wire pattern, protection layer, and tab terminals.
- Substrate with wire pattern and protection layer:
* Substrate has wire pattern on surface * Protection layer covers substrate surface, exposing one edge region
- Tab terminals:
* Plurality of tab terminals connected to wire pattern * Tab terminals arranged on one edge region * Each tab terminal has width larger than wire pattern * Each tab terminal has pattern layer
- Protection and plating layers:
* Protection layer on pattern layer where tab terminal connects to wire pattern * Plating layer on remainder of pattern layer
---
- Potential Applications
- Electronics manufacturing
- Circuit board assembly
- Automotive industry
- Problems Solved
- Enhanced protection for wire patterns
- Improved connectivity with tab terminals
- Efficient assembly process
- Benefits
- Increased durability
- Enhanced connectivity
- Streamlined manufacturing process
Original Abstract Submitted
A module board includes a substrate having a wire pattern on a surface, a protection layer covering the surface of the substrate so as to expose one edge region of the substrate surface, and a plurality of tab terminals connected to the wire pattern and arranged on one edge region. Each tab terminal has a width larger than a width of the wire pattern. Each tab terminal has a pattern layer. A protection layer is on the pattern layer at a region where each tab terminal is connected to the wire pattern, and a plating layer is on a remainder of the pattern layer.
