18155988. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kwang Jin Moon of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18155988 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The abstract describes a semiconductor device that includes a substrate, a wiring pattern, and a passivation layer. The passivation layer and substrate have a recess that extends towards the wiring pattern. The device also includes a post connected to the wiring pattern, with a portion within the recess and another portion protruding from the passivation layer. There is a signal bump on the post, consisting of a seed layer, a lower bump, and an upper bump. Additionally, there is a heat transfer bump that is electrically insulated from the wiring pattern, consisting of another seed layer, another lower bump, and another upper bump.
- The semiconductor device includes a substrate, wiring pattern, passivation layer, post, signal bump, and heat transfer bump.
- The passivation layer and substrate have a recess that extends towards the wiring pattern.
- The post is connected to the wiring pattern and has a portion within the recess and another portion protruding from the passivation layer.
- The signal bump on the post consists of a seed layer, a lower bump, and an upper bump.
- The heat transfer bump is electrically insulated from the wiring pattern and consists of another seed layer, another lower bump, and another upper bump.
Potential applications of this technology:
- This semiconductor device can be used in various electronic devices such as smartphones, computers, and IoT devices.
- It can be used in integrated circuits, microprocessors, and memory chips.
Problems solved by this technology:
- The recess in the passivation layer and substrate allows for better integration of the post and wiring pattern, improving the overall performance and reliability of the device.
- The heat transfer bump provides efficient heat dissipation, preventing overheating and potential damage to the device.
Benefits of this technology:
- Improved performance and reliability of the semiconductor device.
- Enhanced heat dissipation capabilities, leading to better thermal management.
- Increased integration possibilities for the post and wiring pattern.
Original Abstract Submitted
A semiconductor device including a substrate, a wiring pattern in the substrate, a passivation layer on the substrate, the passivation layer and the substrate including a first recess penetrating a part of each of the passivation layer and the substrate and extending toward the wiring pattern, a post connected to the wiring pattern and including a first portion within the first recess and a second portion on the first portion and protruding from a top surface of the passivation layer, a signal bump including a seed layer on the post, a lower bump on the seed layer, and an upper bump on the lower bump, and a heat transfer bump apart from the signal bump, electrically insulated from the wiring pattern, and including another seed layer on the passivation layer, another lower bump on the another seed layer, and another upper bump on the another lower bump may be provided.
