18155713. SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Jie Chen of New Taipei City (TW)

Ming-Fa Chen of Taichung City (TW)

Chih-Chia Hu of Taipei (TW)

SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH - A simplified explanation of the abstract

This abstract first appeared for US patent application 18155713 titled 'SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH

Simplified Explanation

The abstract describes a semiconductor package that includes a first die with two different sides and a first seal ring. The first seal ring has a smaller width on one side and a larger width on the other side.

• The semiconductor package includes a first die with two different sides.
• The first die has a first seal ring that has different widths on each side.
• The width of the first seal ring is smaller on one side and larger on the other side.

Potential Applications:

• Semiconductor manufacturing
• Electronics industry
• Integrated circuit packaging

Problems Solved:

• Provides a seal ring with different widths on each side of the die.
• Allows for better sealing and protection of the semiconductor package.

Benefits:

• Improved sealing and protection of the semiconductor package.
• Enhanced performance and reliability of the integrated circuit.
• Potential cost savings in manufacturing and packaging processes.

Original Abstract Submitted

A semiconductor package includes a first die. The first die has a first side and a second side different from the first side and includes a first seal ring. The first seal ring includes a first portion at the first side and a second portion at the second side, and a width of the first portion is smaller than a width of the second portion.