18151943. PAD REMOVAL METHOD AND DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
PAD REMOVAL METHOD AND DEVICE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Sheng-Chen Wang of Hsinchu (TW)
PAD REMOVAL METHOD AND DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18151943 titled 'PAD REMOVAL METHOD AND DEVICE
Simplified Explanation
The abstract describes a method for removing a pad by affixing a pad guide to two locations on the pad and then moving one end of the guide to a different position.
- The method involves attaching a pad guide to a pad at two different locations.
- One end of the pad guide is moved from its initial position to a different position.
- The distance between the two positions is greater than the diameter of the pad.
- The second position is closer to the second location on the pad and has a distance less than the width of the pad.
Potential Applications
- This method can be used in various industries where pads need to be removed, such as in manufacturing processes or medical applications.
- It can be applied to remove pads from surfaces that require regular maintenance or replacement.
Problems Solved
- The method provides a controlled and efficient way to remove pads without causing damage to the pad or the surface it is attached to.
- It eliminates the need for manual removal methods that can be time-consuming and potentially result in damage.
Benefits
- The pad removal method ensures precise and accurate removal of pads.
- It reduces the risk of damage to the pad or the surface it is attached to.
- The method is efficient and can save time in pad removal processes.
Original Abstract Submitted
A pad removal method includes affixing a first end of a pad guide to a first location of a pad. The method further includes affixing a second end of the pad guide to a second location of the pad. The method further includes moving the first end from a first position, a first distance from the second location, to a second position, a second distance from the second location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the width of the pad.