18143670. MODULE TRAY FOR SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 MODULE TRAY FOR SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MODULE TRAY FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MODULE TRAY FOR SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
MODULE TRAY FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18143670 titled 'MODULE TRAY FOR SEMICONDUCTOR DEVICE
Simplified Explanation
The module tray for a semiconductor device described in the abstract includes a base plate, sidewalls, a dividing wall, fastening guides, fastening grooves, and guide grooves.
- Base plate, sidewalls, and dividing wall create an accommodation space for the semiconductor device.
- Fastening guides with fastening grooves and guide grooves with curved concave shapes provide secure attachment for the device.
- Gradually widening upper end portions of fastening grooves allow for easy insertion and removal of the semiconductor device.
Potential Applications
The module tray could be used in the manufacturing and assembly of various semiconductor devices, such as microchips, processors, and memory modules.
Problems Solved
The module tray solves the problem of securely holding and organizing semiconductor devices during production and assembly processes.
Benefits
The module tray provides a stable and secure platform for semiconductor devices, reducing the risk of damage or misplacement during handling and assembly.
Potential Commercial Applications
The module tray could be utilized by semiconductor manufacturers, electronics companies, and assembly plants to streamline production processes and improve efficiency.
Possible Prior Art
One possible prior art for this technology could be similar module trays used in the semiconductor industry for organizing and handling electronic components during manufacturing processes.
Unanswered Questions
How does the design of the module tray impact the overall efficiency of semiconductor device assembly processes?
The design of the module tray, with its fastening guides and grooves, could potentially improve the efficiency of assembly processes by providing a secure and organized platform for semiconductor devices.
What materials are typically used in the construction of module trays for semiconductor devices?
The materials used in the construction of module trays can vary, but common options include plastic, metal, or composite materials that offer durability and stability for holding semiconductor devices.
Original Abstract Submitted
A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.
