18139674. APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

From WikiPatents
Revision as of 05:10, 26 April 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

APPARATUS FOR MEASURING AN ADHESION FORCE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Donggap Shin of Suwon-si (KR)

Yongin Lee of Suwon-si (KR)

Wooyoung Kim of Suwon-si (KR)

Bumki Moon of Suwon-si (KR)

Jiwon Moon of Suwon-si (KR)

Seungdae Seok of Suwon-si (KR)

Siwoong Woo of Suwon-si (KR)

Byeongtak Park of Suwon-si (KR)

APPARATUS FOR MEASURING AN ADHESION FORCE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18139674 titled 'APPARATUS FOR MEASURING AN ADHESION FORCE

Simplified Explanation

The apparatus described in the patent application is designed to measure the adhesion force of a specimen by using a sensor adhered to the specimen. The sensor detects the force required to detach it from the specimen, providing a way to quantify the adhesion force.

  • The apparatus includes a stage to support the specimen.
  • A sensor is attached to the specimen to detect the adhesion force.
  • The adhesion force is measured as the force needed to detach the sensor from the specimen.

Potential Applications

This technology could be used in various industries such as:

  • Material science for testing adhesion properties of coatings.
  • Biomedical research for studying cell adhesion forces.
  • Quality control in manufacturing for assessing bonding strength of materials.

Problems Solved

This technology helps in:

  • Providing a quantitative measurement of adhesion force.
  • Ensuring accurate and reliable testing of adhesion properties.
  • Facilitating research and development in adhesion-related fields.

Benefits

The benefits of this technology include:

  • Improved understanding of adhesion properties.
  • Enhanced quality control processes.
  • Increased efficiency in research and development.

Potential Commercial Applications

Potential commercial applications of this technology could include:

  • Selling the apparatus to research institutions and laboratories.
  • Offering testing services for industries requiring adhesion force measurements.
  • Licensing the technology to manufacturers for in-house quality control.

Possible Prior Art

One possible prior art in this field is the use of atomic force microscopy (AFM) for measuring adhesion forces at the nanoscale level. AFM has been widely used in research and industry for studying adhesion properties of various materials.

Unanswered Questions

How does this technology compare to existing methods for measuring adhesion force?

This article does not provide a direct comparison with other methods such as AFM or tensile testing. It would be helpful to understand the advantages and limitations of this apparatus compared to existing techniques.

What are the potential limitations or challenges in implementing this technology in different industries?

The article does not address the potential challenges in adapting this technology for use in diverse applications. It would be beneficial to explore the feasibility and practicality of using this apparatus in various industrial settings.


Original Abstract Submitted

An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.