18136416. SOLDER REFLOW APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SOLDER REFLOW APPARATUS
SOLDER REFLOW APPARATUS
Organization Name
Inventor(s)
SOLDER REFLOW APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18136416 titled 'SOLDER REFLOW APPARATUS
Simplified Explanation
The solder reflow apparatus described in the patent application is a device used for mounting electronic parts on a substrate by heating solder with a heat transfer fluid in a reflow chamber. The apparatus includes a heater to heat the heat transfer fluid, a stage to support the substrate, and a jig to fix the electronic part in place.
- Reflow chamber for heat transfer fluid
- Heater to heat the heat transfer fluid
- Stage to support the substrate
- Jig to fix the electronic part
Potential Applications
The technology can be used in the manufacturing of electronic devices, such as circuit boards, where precise soldering of electronic components is required.
Problems Solved
The solder reflow apparatus solves the problem of achieving consistent and reliable soldering of electronic parts onto substrates, which is crucial for the functionality and longevity of electronic devices.
Benefits
The benefits of this technology include improved efficiency in the soldering process, higher quality solder joints, and reduced chances of defects in electronic assemblies.
Potential Commercial Applications
The solder reflow apparatus can be utilized in electronics manufacturing companies, contract manufacturers, and research institutions involved in the development of electronic devices.
Possible Prior Art
One possible prior art for this technology is the use of reflow ovens in electronics manufacturing for soldering components onto circuit boards. These ovens use a similar principle of heating solder to achieve proper mounting of electronic parts.
Unanswered Questions
How does the solder reflow apparatus compare to traditional soldering methods?
The article does not provide a direct comparison between the solder reflow apparatus and traditional soldering methods in terms of efficiency, cost, or quality of solder joints.
What safety measures are in place to prevent overheating or other hazards in the reflow chamber?
The article does not mention specific safety features or protocols to ensure the safe operation of the solder reflow apparatus and prevent accidents related to overheating or other hazards.
Original Abstract Submitted
A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.
