18134966. POWER MODULE simplified abstract (Kia Corporation)
Contents
- 1 POWER MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional power module designs in terms of cost-effectiveness?
- 1.11 Are there any specific industries or applications where this technology would not be suitable?
- 1.12 Original Abstract Submitted
POWER MODULE
Organization Name
Inventor(s)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18134966 titled 'POWER MODULE
Simplified Explanation
The abstract of the patent application describes a power module that simplifies the assembly process, reduces overall size, and improves reliability by utilizing a compact, unified insulating substrate in a single casing.
- Simplifies assembly process by disposing a compact, unified insulating substrate in a single casing.
- Reduces overall size by selectively applying the insulating substrate according to specifications of the power module.
- Improves reliability by preventing a decrease in lifespan due to heat as the size of the insulating substrate is reduced.
Potential Applications
The technology can be applied in various electronic devices and systems that require power modules, such as electric vehicles, renewable energy systems, and industrial machinery.
Problems Solved
1. Complex assembly processes due to multiple components can be simplified. 2. Heat-related issues leading to decreased lifespan of power modules can be prevented.
Benefits
1. Simplified assembly process. 2. Reduced overall size. 3. Improved reliability and lifespan of power modules.
Potential Commercial Applications
"Compact Insulating Substrate Power Module Technology for Enhanced Reliability and Performance"
Possible Prior Art
There may be existing patents or technologies related to power modules with insulating substrates, but the specific approach of using a compact, unified insulating substrate in a single casing for simplifying assembly and improving reliability may be unique to this patent application.
Unanswered Questions
How does this technology compare to traditional power module designs in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this technology compared to traditional power module designs.
Are there any specific industries or applications where this technology would not be suitable?
The article does not mention any limitations or specific industries where this technology may not be suitable.
Original Abstract Submitted
A power module makes it possible to simplify an assembly process by disposing a compact, unified insulating substrate in a single casing, reduce overall size by selectively applying the insulating substrate according to specifications of the power module, and improve reliability by preventing a decrease in lifespan due to heat as the size of the insulating substrate is reduced. In other words, by placing the compact, unified insulating substrate in parallel in the casing, the assembly process of the insulating substrate may be facilitated, and as the size of the insulating substrate is reduced, the performance and reliability of the power module can be improved.
