18134966. POWER MODULE simplified abstract (Hyundai Motor Company)

POWER MODULE

Organization Name

Hyundai Motor Company

Inventor(s)

Myung Ill You of Gwangju (KR)

POWER MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18134966 titled 'POWER MODULE

Simplified Explanation

The abstract of the patent application describes a power module that simplifies the assembly process, reduces overall size, and improves reliability by using a compact, unified insulating substrate in a single casing.

• Simplification of assembly process:

 - By disposing a compact, unified insulating substrate in a single casing, the assembly process is simplified.
 - Placing the insulating substrate in parallel in the casing facilitates the assembly process.

• Reduction in overall size:

 - The overall size of the power module is reduced by selectively applying the insulating substrate according to specifications.
 - As the size of the insulating substrate is reduced, the performance and reliability of the power module are improved.

• Improvement in reliability:

 - Prevents a decrease in lifespan due to heat by using the insulating substrate effectively.
 - The compact insulating substrate helps in improving the reliability of the power module.

---

1. 1. 1. Potential Applications

The technology can be applied in various electronic devices and systems where power modules are used, such as inverters, converters, motor drives, and power supplies.

1. 1. 1. Problems Solved

1. Complex assembly processes due to multiple components are simplified. 2. Heat-related issues that can decrease the lifespan of the power module are prevented.

1. 1. 1. Benefits

1. Simplifies assembly processes. 2. Reduces overall size. 3. Improves reliability and performance. 4. Enhances the efficiency of power modules.

1. 1. 1. Potential Commercial Applications
         1. Optimizing Power Module Assembly with Compact Insulating Substrate

---

1. 1. 1. Possible Prior Art

Prior art may include traditional power module designs that use larger, separate insulating substrates, leading to more complex assembly processes and potentially reduced reliability due to heat issues.

---

1. 1. 1. 1. Unanswered Questions

1. 1. 1. How does the compact insulating substrate impact the thermal management of the power module?

The abstract does not provide specific details on how the compact insulating substrate affects the thermal management of the power module. Further information on thermal conductivity and heat dissipation capabilities would be beneficial.

1. 1. 1. What specific materials are used in the compact, unified insulating substrate?

The abstract does not mention the materials used in the insulating substrate. Understanding the composition of the substrate could provide insights into its performance and reliability in different operating conditions.

Original Abstract Submitted

A power module makes it possible to simplify an assembly process by disposing a compact, unified insulating substrate in a single casing, reduce overall size by selectively applying the insulating substrate according to specifications of the power module, and improve reliability by preventing a decrease in lifespan due to heat as the size of the insulating substrate is reduced. In other words, by placing the compact, unified insulating substrate in parallel in the casing, the assembly process of the insulating substrate may be facilitated, and as the size of the insulating substrate is reduced, the performance and reliability of the power module can be improved.