18134464. POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME simplified abstract (Hyundai Motor Company)

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POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME

Organization Name

Hyundai Motor Company

Inventor(s)

Myung Ill You of Gwangju (KR)

Hyun Koo Lee of Seoul (KR)

POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18134464 titled 'POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME

Simplified Explanation

The power module for a vehicle described in the patent application includes a circuit board with multiple switching portions and semiconductor chips, a lead frame, and a signal lead.

  • The power module includes a circuit board with a first metallic layer.
  • A first switching portion is located in the center of the circuit board and contains multiple semiconductor chips.
  • A second switching portion is positioned outside the first switching portion and also contains multiple semiconductor chips.
  • A third switching portion is located outside the first switching portion on the circuit board.
  • A lead frame is placed on one side of the circuit board.
  • A signal lead is located on the other side of the circuit board.

Potential Applications

The technology described in this patent application could be used in electric vehicles, hybrid vehicles, and other automotive applications where power modules are required.

Problems Solved

This technology solves the problem of efficiently managing power distribution and switching within a vehicle, ensuring optimal performance and reliability.

Benefits

The benefits of this technology include improved power management, increased efficiency, and enhanced overall performance of the vehicle.

Potential Commercial Applications

The technology could be commercially applied in the automotive industry for manufacturing power modules for electric and hybrid vehicles.

Possible Prior Art

One possible prior art for this technology could be existing power module designs used in vehicles, although specific details may vary.

Unanswered Questions

How does this technology compare to traditional power module designs in terms of efficiency and performance?

The article does not provide a direct comparison between this technology and traditional power module designs.

What are the potential cost implications of implementing this technology in vehicle manufacturing?

The article does not address the potential cost implications of implementing this technology in vehicle manufacturing.


Original Abstract Submitted

A power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.