18133178. SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18133178 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a method for determining the surface temperature of a semiconductor package that contains a semiconductor die. The method involves setting the air temperature near the package to different reference temperatures and measuring corresponding reference code values using a temperature code provided by a reference temperature measurement circuit integrated in the package. Calibration information is then generated to establish mapping relationships between the reference temperatures and code values. The present surface temperature of the package can be determined using the calibration information and the present code value of the temperature code.
- The method involves setting the air temperature near the semiconductor package to different reference temperatures.
- Reference code values are measured based on a temperature code provided by a reference temperature measurement circuit integrated in the package.
- Calibration information is generated to establish mapping relationships between the reference temperatures and code values.
- The present surface temperature of the package can be determined using the calibration information and the present code value of the temperature code.
Potential Applications
- This method can be used in the manufacturing and testing of semiconductor packages to accurately measure and monitor the surface temperature of the package.
- It can be applied in various industries that utilize semiconductor packages, such as electronics, telecommunications, automotive, and aerospace.
Problems Solved
- Traditional methods of measuring surface temperature of semiconductor packages may not provide accurate results.
- This method solves the problem of accurately determining the surface temperature of a semiconductor package by using a reference temperature measurement circuit and calibration information.
Benefits
- Accurate measurement of surface temperature allows for better control and monitoring of the semiconductor package during manufacturing and operation.
- The method provides a reliable and efficient way to determine the surface temperature without the need for complex and expensive equipment.
- It can help prevent overheating and potential damage to the semiconductor package, improving its overall performance and lifespan.
Original Abstract Submitted
A method of providing a surface temperature of a semiconductor package including a semiconductor die that is packaged using a molding material includes setting an air temperature near the semiconductor package to each of reference temperatures, measuring reference code values respectively corresponding to the reference temperatures based on a temperature code indicating a junction temperature in the semiconductor die while the air temperature is set to each of the reference temperatures, the temperature code being provided from a reference temperature measurement circuit integrated in the semiconductor package, generating calibration information that indicates mapping relationships between the reference temperatures and the reference code values, and providing a present surface temperature of the semiconductor package based on the calibration information and a present code value of the temperature code.
