18132169. BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME
Organization Name
Inventor(s)
Younhwan Shin of Suwon-si (KR)
BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18132169 titled 'BLADE FOR SAWING A PANEL LEVEL PACKAGE AND METHOD OF SAWING A PANEL LEVEL PACKAGE USING THE SAME
Simplified Explanation
The patent application describes a blade for sawing a panel, with a first blade portion for sawing along one direction and a second blade portion on top of the first blade portion for sawing along another direction perpendicular to the first.
- The blade is designed to saw a panel with panel level packages (PLPs) arranged in two directions.
- The second blade portion is wider than the first blade portion.
Potential Applications
This technology could be used in industries that require precise cutting of panels with PLPs arranged in multiple directions, such as electronics manufacturing or woodworking.
Problems Solved
This blade solves the problem of efficiently cutting panels with PLPs arranged in different directions without the need for multiple tools or setups.
Benefits
The blade offers a versatile solution for cutting panels with complex arrangements of PLPs, increasing efficiency and accuracy in the cutting process.
Potential Commercial Applications
"Blade for Sawing Panels with Multiple PLP Directions" could be used in industries such as electronics manufacturing, woodworking, and panel production for various applications.
Possible Prior Art
There may be prior art related to blades for cutting panels with complex arrangements, but specific information on similar innovations is not provided in the abstract.
Unanswered Questions
How does this blade compare to traditional sawing methods for panels with PLPs in multiple directions?
This article does not provide a direct comparison between this blade and traditional sawing methods for panels with PLPs in multiple directions. Further research or testing may be needed to determine the advantages of this blade over traditional methods.
What materials are recommended for optimal performance of this blade?
The abstract does not specify the materials recommended for optimal performance of this blade. Understanding the ideal materials could help users maximize the efficiency and longevity of the blade.
Original Abstract Submitted
A blade for sawing a panel, including a first blade portion configured to saw the panel along a first direction, wherein the panel includes a plurality of panel level packages (PLPs) arranged in the first direction and a second direction which is substantially perpendicular to the first direction; and a second blade portion arranged on an upper surface of the first blade portion, and configured to saw the panel along the second direction, wherein a width of the second blade portion is greater than a width of the first blade portion.
