18117592. SUBSTRATE PROCESSING APPARATUS INCLUDING NOZZLE UNIT AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS INCLUDING NOZZLE UNIT AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS INCLUDING NOZZLE UNIT AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 What is the cost-effectiveness of implementing this technology in existing manufacturing processes?
- 1.11 How does this technology compare to existing substrate drying methods in terms of energy consumption?
- 1.12 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS INCLUDING NOZZLE UNIT AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Ju Hwan Lee of Hwaseong-si (KR)
Hyeon Jun Lee of Cheonan-si (KR)
So Young Park of Cheonan-si (KR)
SUBSTRATE PROCESSING APPARATUS INCLUDING NOZZLE UNIT AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18117592 titled 'SUBSTRATE PROCESSING APPARATUS INCLUDING NOZZLE UNIT AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The patent application describes a substrate processing apparatus that improves substrate drying performance by separately providing a chemical liquid supply nozzle and a gas supply nozzle.
- The apparatus includes a chemical liquid supply nozzle and a gas supply nozzle.
- The separate provision of these nozzles enhances substrate drying performance.
Potential Applications
The technology could be applied in semiconductor manufacturing, solar panel production, and other industries requiring precise substrate processing.
Problems Solved
1. Inefficient substrate drying processes. 2. Inadequate control over drying performance.
Benefits
1. Improved substrate drying performance. 2. Enhanced control and precision in substrate processing. 3. Potential for increased productivity and efficiency in manufacturing processes.
Potential Commercial Applications
Optimizing substrate processing in semiconductor fabrication plants for increased yield and quality.
Possible Prior Art
There may be prior art related to substrate processing apparatus with separate nozzles for chemical liquid and gas supply, but specific examples are not provided in this context.
Unanswered Questions
What is the cost-effectiveness of implementing this technology in existing manufacturing processes?
Answer: The cost-effectiveness of integrating this technology would depend on factors such as initial investment, operational efficiency gains, and potential cost savings from improved substrate processing.
How does this technology compare to existing substrate drying methods in terms of energy consumption?
Answer: It would be important to compare the energy consumption of this technology with traditional substrate drying methods to assess its environmental impact and sustainability.
Original Abstract Submitted
Proposed are a substrate processing apparatus having improved substrate drying performance by separately providing a chemical liquid supply nozzle and a gas supply nozzle; and a substrate processing method.
