18103747. SEMICONDUCTOR CHIP HAVING CHAMFER REGION FOR CRACK PREVENTION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR CHIP HAVING CHAMFER REGION FOR CRACK PREVENTION
Organization Name
Inventor(s)
Hyunhaeng Heo of Suwon-si (KR)
SEUNGYEON Kim of Suwon-si (KR)
SEMICONDUCTOR CHIP HAVING CHAMFER REGION FOR CRACK PREVENTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18103747 titled 'SEMICONDUCTOR CHIP HAVING CHAMFER REGION FOR CRACK PREVENTION
Simplified Explanation
The semiconductor chip described in the patent application includes a guard ring that surrounds the edges of a semiconductor substrate. It also has an internal circuit structure formed on the substrate, which includes a memory cell array region and a peripheral circuit region. Additionally, there is a crack detection circuit located between the guard ring and the internal circuit structure to detect cracks. The chip also includes chamfer regions with different shapes and sizes depending on the position of a pad or the design arrangement of the internal circuit structure.
- The semiconductor chip includes a guard ring to protect the edges of the substrate.
- It has an internal circuit structure with a memory cell array region and a peripheral circuit region.
- A crack detection circuit is included to detect cracks in the chip.
- The chip has chamfer regions with different shapes and sizes based on the pad position or internal circuit structure design.
Potential Applications:
- This technology can be used in various electronic devices that utilize semiconductor chips, such as smartphones, tablets, and computers.
- It can be applied in automotive electronics, aerospace systems, and industrial control systems.
Problems Solved:
- The guard ring helps prevent damage to the edges of the semiconductor substrate, reducing the risk of failure or malfunction.
- The crack detection circuit allows for early detection of cracks, enabling timely repairs or replacements to prevent further damage.
Benefits:
- Improved reliability and durability of semiconductor chips.
- Enhanced protection against cracks and damage.
- Early detection of cracks for proactive maintenance and prevention of failures.
Original Abstract Submitted
A semiconductor chip including a guard ring that surrounds edges of a semiconductor substrate, an internal circuit structure that is formed on the semiconductor substrate and that includes a memory cell array region and a peripheral circuit region, and a crack detection circuit that is located between the guard ring and the internal circuit structure and that detects whether a crack occurs. The semiconductor chip further includes first to fourth chamfer regions having different shapes and sizes depending on the position of a pad or the design arrangement of the internal circuit structure.
