18099522. HEAT-DISSIPATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE HEAT-DISSIPATING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
HEAT-DISSIPATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE HEAT-DISSIPATING STRUCTURE
Organization Name
Inventor(s)
Chihwan Jeong of Suwon-si (KR)
HEAT-DISSIPATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE HEAT-DISSIPATING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18099522 titled 'HEAT-DISSIPATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE HEAT-DISSIPATING STRUCTURE
Simplified Explanation
The disclosed patent application describes a heat-dissipating structure that includes a case with two bodies spaced apart from each other. A wick is placed between the bodies, consisting of multiple wires arranged in two directions, with a working fluid passage formed along at least one opening between the wires. A channel is also formed between the first body and the wick, allowing the working fluid to move through the opening based on changes in its state.
- The heat-dissipating structure includes a case with two bodies and a wick.
- The wick consists of multiple wires arranged in two directions.
- The wick has a working fluid passage formed along at least one opening between the wires.
- A channel is formed between the first body and the wick.
- The working fluid can move through the opening in the wick based on changes in its state.
Potential Applications
- Electronics cooling systems
- Heat sinks for computer processors
- Thermal management in electric vehicles
- Cooling systems for industrial machinery
Problems Solved
- Efficient heat dissipation in confined spaces
- Enhanced cooling performance for high-power electronic devices
- Improved thermal management in various applications
Benefits
- Increased heat dissipation efficiency
- Compact design for space-constrained applications
- Improved reliability and performance of electronic devices
- Cost-effective solution for thermal management.
Original Abstract Submitted
Disclosed is a heat-dissipating structure comprising: a case including: a first body and a second body spaced apart from each other; a wick disposed in a space between the first body and the second body, the wick including a plurality of wires arranged in a first direction and in a second direction intersecting the first direction, and having a working fluid passage formed along at least one opening formed between the plurality of wires; and a channel formed between the first body and the wick and in which the working fluid is moved through the at least one opening according to a change in state of the working fluid.
