18097540. POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18097540 titled 'POLISHING APPARATUS FOR A SUBSTRATE AND POLISHING METHOD FOR A SUBSTRATE USING THE SAME
Simplified Explanation
The abstract describes a polishing apparatus for a substrate that includes a polishing pad, a platen, a light source unit, a slurry supply unit, and a polishing head.
- The polishing pad is made of a light-transmitting material and is placed on the upper surface of the platen.
- The platen has a groove portion that overlaps with the polishing pad and rotates in one direction.
- The light source unit is housed in the groove portion of the platen and emits light of a specific wavelength to the polishing pad.
- The slurry supply unit provides a slurry containing photocatalyst particles that are excited by the light to the polishing pad.
- The polishing head is installed on the polishing pad and rotates a semiconductor substrate in close contact with the polishing pad.
Potential applications of this technology:
- Semiconductor manufacturing: This apparatus can be used for polishing semiconductor substrates, ensuring a high-quality surface finish.
- Optics manufacturing: The light-transmitting polishing pad and the light source unit can be utilized for polishing optical components, such as lenses or mirrors.
- Metal polishing: The slurry supply unit with photocatalyst particles can be employed for polishing metal surfaces, improving their smoothness and appearance.
Problems solved by this technology:
- Improved polishing efficiency: The combination of the light source unit and the slurry supply unit enhances the polishing process, resulting in faster and more effective substrate polishing.
- Enhanced surface quality: The use of a light-transmitting polishing pad and the specific wavelength light source ensures a high-quality surface finish with minimal defects.
- Uniform polishing: The rotating platen and polishing head ensure even and consistent polishing across the entire substrate.
Benefits of this technology:
- Time and cost savings: The improved polishing efficiency reduces the time required for substrate polishing, leading to cost savings in manufacturing processes.
- High-quality results: The combination of the light source unit, slurry supply unit, and polishing head ensures a superior surface finish with minimal defects.
- Versatility: The apparatus can be used for various substrates, including semiconductors, optics, and metals, making it a versatile tool in different industries.
Original Abstract Submitted
A polishing apparatus for a substrate, includes: a polishing pad having at least one region formed of a light-transmitting material; a platen on which the polishing pad is disposed on an upper surface thereof, having a groove portion in a region overlapping the polishing pad, and rotatably installed in one direction; a light source unit accommodated in the groove portion of the platen, and emitting light of a predetermined wavelength band to the one region of the polishing pad; a slurry supply unit supplying a slurry containing photocatalyst particles excited by the light of the predetermined wavelength band to the polishing pad; and a polishing head installed on the polishing pad to be spaced apart from the slurry supply unit in the one direction, and rotating a semiconductor substrate in close contact with the polishing pad.
