18080348. PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sumin Kim of Suwon-si (KR)

Hyunwoo Kim of Seongnam-si (KR)

Sukkoo Hong of Suwon-si (KR)

Yechan Kim of Hwaseong-si (KR)

Juyoung Kim of Busan (KR)

Jinjoo Kim of Seoul (KR)

Juhyeon Park of Suwon-si (KR)

Hyunji Song of Anyang-si (KR)

Songse Yi of Seoul (KR)

PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18080348 titled 'PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE

Simplified Explanation

The abstract describes a photo-decomposable compound that can be used in a photoresist composition for manufacturing integrated circuit (IC) devices. The compound includes an anion component with an adamantyl group and a cation component with a cyclic hydrocarbon group. The compound also has a substituent that decomposes when exposed to acid, generating an alkali soluble group. The photoresist composition includes the compound, a chemically amplified polymer, and a solvent. The process involves forming a photoresist film on a feature layer, exposing a specific area of the film to generate acids from the compound, deprotecting the polymer due to the acids, and removing the exposed area to create a photoresist pattern.

• The patent application describes a photo-decomposable compound for use in a photoresist composition.
• The compound includes an anion component with an adamantyl group and a cation component with a cyclic hydrocarbon group.
• The compound has a substituent that decomposes when exposed to acid, generating an alkali soluble group.
• The photoresist composition includes the compound, a chemically amplified polymer, and a solvent.
• The process involves forming a photoresist film, exposing a specific area to generate acids, deprotecting the polymer, and removing the exposed area to create a photoresist pattern.

Potential Applications

• Manufacturing integrated circuit (IC) devices
• Semiconductor industry
• Photolithography processes

Problems Solved

• Improved photoresist compositions for IC device manufacturing
• Enhanced resolution and pattern formation in photolithography processes

Benefits

• Higher precision and accuracy in IC device manufacturing
• Increased efficiency and productivity in photolithography processes
• Improved control over photoresist patterns

Original Abstract Submitted

A photo-decomposable compound includes an anion component including an adamantyl group and a cation component including a C5 to C40 cyclic hydrocarbon group and forming a complex with the anion component. At least one of the adamantyl group and the cyclic hydrocarbon group has a substituent, which decomposes by acid and generates an alkali soluble group. The substituent includes an acid-labile protecting group. A photoresist composition includes a chemically amplified polymer, the photo-decomposable compound, and a solvent. To manufacture an integrated circuit (IC) device, a photoresist film is formed using the photoresist composition on a feature layer, a first area of the photoresist film is exposed to generate a plurality of acids from the photo-decomposable compound in the first area, the chemically amplified polymer is deprotected due to the plurality of acids, and the first area is removed to form a photoresist pattern.