18062843. MEMORY DEVICE FOR OUTPUTTING TEST RESULTS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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MEMORY DEVICE FOR OUTPUTTING TEST RESULTS

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jongpil Son of Suwon-si (KR)

MEMORY DEVICE FOR OUTPUTTING TEST RESULTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18062843 titled 'MEMORY DEVICE FOR OUTPUTTING TEST RESULTS

Simplified Explanation

The abstract describes a memory device that includes a memory cell array and a repair circuit. The repair circuit is designed to perform a repair operation and send a dirty signal to an external destination.

  • The repair circuit selects a first redundancy address instead of a first fail address for a failed memory cell.
  • It stores a mapping between the first fail address and the first redundancy address.
  • If a second failed memory cell has the same fail address as the first one, the repair circuit ignores the previous mapping and outputs a dirty signal.
  • The dirty signal causes a new mapping to be created, mapping the first fail address to a different redundancy address.

Potential applications of this technology:

  • Memory devices in electronic devices such as computers, smartphones, and tablets.
  • Data storage systems in servers and data centers.
  • Embedded memory in various electronic devices.

Problems solved by this technology:

  • Efficient repair of failed memory cells in a memory device.
  • Reducing the impact of memory cell failures on the overall performance of the device.
  • Minimizing the need for physical repairs or replacements of memory cells.

Benefits of this technology:

  • Improved reliability and longevity of memory devices.
  • Reduced downtime and maintenance costs.
  • Enhanced performance and efficiency of electronic devices.


Original Abstract Submitted

A memory device includes a memory cell array and a repair circuit configured to perform a repair operation and output a dirty signal to an external destination external to the memory device. The repair circuit further performs selecting a first redundancy address of the redundancy memory cells instead of a first fail address of the first failed memory cell, storing a first redundancy mapping for the first fail address to the first redundancy address, and in response to determining a second fail address of a second failed memory cell matches the first fail address, ignoring the first redundancy mapping, and outputting a dirty signal causing a second redundancy mapping to map the first fail address to a second redundancy address different from the first redundancy address of the redundancy memory cells.