18061229. APPARATUS FOR MOUNTING SOLDER BALLS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
APPARATUS FOR MOUNTING SOLDER BALLS
Organization Name
Inventor(s)
APPARATUS FOR MOUNTING SOLDER BALLS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18061229 titled 'APPARATUS FOR MOUNTING SOLDER BALLS
Simplified Explanation
The patent application describes an apparatus for mounting solder balls on a substrate using a solder ball mask. The solder ball mask has through-holes that allow the solder balls to move through them. The through-holes have different spacings between the first and second openings.
- The apparatus includes a stage to support a substrate, a mounting unit to mount solder balls, and a solder ball mask.
- The solder ball mask has inner surfaces with through-holes that extend from one face to the other.
- Each through-hole has a first opening on the face facing the substrate and a second opening on the opposite face.
- The through-holes are designed with different spacings between the first and second openings.
Potential applications of this technology:
- Electronics manufacturing: The apparatus can be used in the production of electronic devices that require precise solder ball placement, such as circuit boards.
- Semiconductor packaging: The technology can be applied in the assembly of semiconductor devices, ensuring accurate solder ball positioning.
- Microelectronics: The apparatus can be utilized in the manufacturing of microelectronic components that rely on solder ball connections.
Problems solved by this technology:
- Accurate solder ball placement: The apparatus ensures that solder balls are mounted precisely on the substrate, reducing the risk of misalignment or short circuits.
- Efficient solder ball mounting: The through-holes in the solder ball mask allow for separate movement of solder balls, enabling faster and more efficient mounting processes.
Benefits of this technology:
- Improved manufacturing precision: The apparatus helps achieve precise solder ball placement, resulting in higher quality electronic devices.
- Time and cost savings: The efficient solder ball mounting process reduces production time and costs associated with manual soldering.
- Enhanced reliability: Accurate solder ball positioning reduces the risk of electrical failures or malfunctions in electronic devices.
Original Abstract Submitted
An apparatus for mounting solder balls comprises a stage to support a substrate thereon, a mounting unit to mount solder balls on the substrate, and a solder ball mask between the mounting unit and the substrate. The solder ball mask includes a first face facing the substrate and a second face opposite to the first face. The solder ball mask has inner surfaces defining through-holes extending through a thickness of the solder ball mask from the second face to the first face. The apparatus causes the solder balls to move through separate, respective through-holes. Each of the through-holes includes a first opening defined in the first face and a second opening defined in the second face. A first spacing between adjacent first openings of the plurality of through-holes is different from a second spacing between adjacent second openings of the through-holes.
