18049301. VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
Contents
- 1 VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
Rajiv Joshi of Yorktown Heights NY (US)
Ruilong Xie of Niskayuna NY (US)
VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18049301 titled 'VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE
Simplified Explanation
The present invention relates to a method and structure for providing a virtual power supply through a wafer backside.
- Front end of line structure with gate formed on one surface
- Back end of line structure formed on the opposite surface
- Backside power delivery network formed on the second surface
- Source and drain regions connected to the power delivery network
- Source and drain regions connected to the back end of line structure
Potential Applications
This technology could be applied in the semiconductor industry for the development of more efficient and compact power delivery systems in integrated circuits.
Problems Solved
This innovation solves the problem of limited space for power supply components in integrated circuits, allowing for more efficient power delivery.
Benefits
The benefits of this technology include improved power delivery efficiency, reduced footprint of power supply components, and potentially lower production costs.
Potential Commercial Applications
One potential commercial application of this technology could be in the development of advanced microprocessors and other semiconductor devices.
Possible Prior Art
One possible prior art could be the use of through-silicon vias (TSVs) for power delivery in integrated circuits. However, the present invention offers a different approach by utilizing the wafer backside for power supply.
Unanswered Questions
1. How does this technology compare to existing methods of power delivery in terms of efficiency and cost-effectiveness? 2. Are there any limitations or challenges in implementing this technology on a large scale in semiconductor manufacturing processes?
Original Abstract Submitted
Embodiments of the present invention are directed to processing methods and resulting structures for providing a virtual power supply through a wafer backside. In a non-limiting embodiment of the invention, a front end of line structure having a gate is formed and a back end of line structure is formed on a first surface of the front end of line structure. A backside power delivery network is formed on a second surface of the front end of line structure opposite the first surface. Source and drain regions on a first side of the gate are connected to the backside power delivery network and source and drain regions on a second side of the gate are connected to the back end of line structure.
