18049143. DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Francesco Preda of New Braunfels TX (US)

Sungjun Chun of Austin TX (US)

Jose A. Hejase of Pflugerville TX (US)

Junyan Tang of Austin TX (US)

Pavel Roy Paladhi of Pflugerville TX (US)

Nam Huu Pham of Round Rock TX (US)

Wiren Dale Becker of Hyde Park NY (US)

Daniel Mark Dreps of Georgetown TX (US)

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18049143 titled 'DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

Simplified Explanation

The enhanced integrated circuit interconnect package described in the patent application enables increased routing density per layer while maintaining signal integrity performance. This is achieved through the use of a differential signal via pair of vertical interconnect vias, positioned closely spaced together with each via offset from a center axis of an associated LGA contact. This minimizes space between the vias, maintains signal integrity performance, and provides increased available wiring signal channel.

• Differential signal via pair of vertical interconnect vias
• Closely spaced vias with offset from center axis of LGA contact
• Minimizes space between vias
• Maintains signal integrity performance
• Increases available wiring signal channel

Potential Applications

The technology described in the patent application could be applied in high-speed data transmission systems, such as in telecommunications equipment, networking devices, and high-performance computing systems.

Problems Solved

This technology solves the problem of limited routing density in integrated circuit packages, as well as the challenge of maintaining signal integrity performance in high-speed data transmission systems.

Benefits

The benefits of this technology include increased routing density per layer, improved signal integrity performance, and enhanced data transmission capabilities in integrated circuit packages.

Potential Commercial Applications

The technology could find commercial applications in the development of advanced networking equipment, high-performance computing systems, and telecommunications infrastructure.

Possible Prior Art

One possible prior art in this field could be the use of differential signaling techniques in integrated circuit interconnect packages to improve signal integrity performance.

Original Abstract Submitted

An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.