18049128. PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
Organization Name
Inventor(s)
Seth J. Bamesberger of Austin TX (US)
Byung-Jin Choi of Austin TX (US)
Steven C. Shackleton of Austin TX (US)
Masaki Saito of Austin TX (US)
PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18049128 titled 'PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
Simplified Explanation
The planarization system described in the abstract includes a superstrate chuck with an inflatable membrane and a purge gas channel for planarizing a superstrate.
- Superstrate chuck with holding surface for superstrate
- Inflatable membrane with inner and outer edges
- Purge gas channel for planarization
Potential Applications
The planarization system could be used in the manufacturing of flat panel displays, solar panels, or semiconductor wafers.
Problems Solved
This technology solves the problem of achieving a flat and smooth surface on delicate superstrates during manufacturing processes.
Benefits
The system allows for precise planarization of superstrates, resulting in improved product quality and performance.
Potential Commercial Applications
"Advanced Planarization System for Superstrate Manufacturing"
Possible Prior Art
There may be prior art related to planarization systems using inflatable membranes in the semiconductor industry.
Unanswered Questions
How does the system handle different sizes and shapes of superstrates?
The abstract does not provide information on the adaptability of the system to various superstrate sizes and shapes.
What is the cost-effectiveness of implementing this system in manufacturing processes?
The abstract does not address the cost implications of using this planarization system compared to other methods.
Original Abstract Submitted
A planarization system, comprising a superstrate chuck including a holding surface configured to hold a superstrate, an inflatable membrane having an inner diameter defining an inner edge, an outer diameter defining an outer edge, and, a midpoint between the inner edge and the outer edge in a radial direction, wherein the inflatable membrane is disposed radially outward of the holding surface of the superstrate chuck, and a purge gas channel disposed radially inward of the midpoint of the inflatable membrane and radially outward of the holding surface of the superstrate chuck.
