18048456. MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

James D. Bielick of Pine Island MN (US)

Theron Lee Lewis of Rochester MN (US)

David J. Braun of St. Charles MN (US)

John R. Dangler of Rochester MN (US)

Timothy P. Younger of Rochester MN (US)

Stephen Michael Hugo of Stewartville MN (US)

Timothy Jennings of Rochester MN (US)

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18048456 titled 'MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD

Simplified Explanation

The abstract describes a method of fabricating a multilayer circuit board with an internal clearance region containing a modified voltage-to-ground clearance of conductive material near an aperture. This modification is based on the configuration of a connector pin to be press-fit connected within the aperture, with the internal clearance region expanding outward from the aperture during insertion of the connector pin.

• The method involves forming a layer of the multilayer circuit board with an internal clearance region.
• The internal clearance region has a modified voltage-to-ground clearance of conductive material.
• The modification is determined by the configuration of a connector pin to be press-fit connected within the aperture.
• The internal clearance region expands in the direction of greatest normal force during insertion of the connector pin.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as smartphones, computers, and other consumer electronics that require multilayer circuit boards.

Problems Solved

This technology helps to ensure proper electrical connections and prevent short circuits in multilayer circuit boards, improving the overall reliability and performance of electronic devices.

Benefits

The method provides a more precise and reliable way of fabricating multilayer circuit boards, leading to enhanced functionality and durability of electronic devices.

Potential Commercial Applications

The technology could be utilized by electronics manufacturers looking to improve the quality and performance of their products, potentially leading to increased customer satisfaction and market competitiveness.

Possible Prior Art

One possible prior art in this field could be the use of specialized materials or techniques to enhance the electrical properties of circuit boards during fabrication.

How does this method compare to traditional methods of fabricating multilayer circuit boards?

This article does not provide a direct comparison between this method and traditional fabrication methods, leaving the reader to wonder about the specific advantages or disadvantages of this new approach.

What are the specific parameters for determining the modified voltage-to-ground clearance of conductive material in the internal clearance region?

The article does not delve into the exact calculations or criteria used to determine the modified voltage-to-ground clearance, leaving a gap in understanding for readers seeking more technical details.

Original Abstract Submitted

A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.