18048155. SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES simplified abstract (Dell Products L.P.)
Contents
- 1 SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
Organization Name
Inventor(s)
JOHN R. Stuewe of Round Rock TX (US)
MICHAEL ALBERT Perks of Austin TX (US)
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18048155 titled 'SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
Simplified Explanation
The abstract of the patent application describes methods, systems, and devices for providing computer-implemented services by using host circuit card integrated heating assemblies to mitigate thermal limitations of hardware components.
- The data processing system includes hardware components that provide computer-implemented services.
- The hardware components may have thermal limitations.
- Host circuit card integrated heating assemblies are used to warm hardware components of devices connected to the host circuit card.
- A thermal conduction path between a device and a heating assembly is established when connected to the host circuit card.
Potential Applications
The technology described in this patent application could be applied in various industries where computer-implemented services are utilized, such as:
- Data centers
- Telecommunications
- Automotive industry
Problems Solved
This technology addresses the following problems:
- Thermal limitations of hardware components in data processing systems
- Ensuring optimal performance of devices connected to the host circuit card
Benefits
The benefits of this technology include:
- Improved performance and reliability of hardware components
- Efficient mitigation of thermal limitations
- Enhanced overall system functionality
Potential Commercial Applications
A potential commercial application of this technology could be in:
- Server systems for data centers
- Networking equipment
- Industrial automation systems
Possible Prior Art
One possible prior art for this technology could be the use of cooling systems in data processing systems to address thermal limitations of hardware components.
Unanswered Questions
How does this technology impact energy consumption in data processing systems?
This article does not provide information on the energy efficiency of the heating assemblies and their impact on overall energy consumption.
Are there any potential drawbacks or limitations to using host circuit card integrated heating assemblies?
The article does not discuss any potential drawbacks or limitations that may arise from implementing this technology.
Original Abstract Submitted
Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have thermal limitations. To mitigate the impact of the thermal limitations, the data processing system may include host circuit card integrated heating assemblies. The heating assemblies may be used to warm hardware components of devices connected to the host circuit card. When connected to the host circuit card, a thermal conduction path between a device and a heating assembly may be established.
