18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS

Organization Name

Intel Corporation

Inventor(s)

Brandon C. Marin of Gilbert AZ (US)

Kristof Kuwawi Darmawikarta of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18046635 titled 'PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS

Simplified Explanation

The patent application describes a microelectronic assembly that includes a first substrate made of glass and at least one inductor, a second substrate coupled to the first side of the first substrate, and a plurality of integrated circuit (IC) dies. The IC dies are divided into three subsets: one subset is directly coupled to the second side of the first substrate, another subset is directly coupled to the second substrate adjacent to the first substrate, and the third subset is embedded in the second substrate between the first substrate and the second subset of IC dies.

• Glass substrate with inductor
• Multiple subsets of IC dies
• Embedded IC dies in second substrate

Potential Applications

The technology described in the patent application could be applied in:

• Microelectronics
• Semiconductor manufacturing
• Electronic devices

Problems Solved

This technology helps in:

• Improving integration of IC dies
• Enhancing performance of microelectronic assemblies
• Increasing efficiency of electronic devices

Benefits

The benefits of this technology include:

• Higher density of components
• Improved signal processing
• Enhanced reliability of electronic systems

Potential Commercial Applications

The potential commercial applications of this technology could be seen in:

• Consumer electronics
• Telecommunications
• Automotive industry

Possible Prior Art

One possible prior art for this technology could be:

• Existing methods of integrating IC dies in substrates

Unanswered Questions

How does the technology impact power consumption in electronic devices?

The article does not specifically address the impact of this technology on power consumption in electronic devices.

What are the potential challenges in scaling up production using this technology?

The article does not discuss the potential challenges that may arise in scaling up production using this technology.

Original Abstract Submitted

Embodiments described herein enable a microelectronic assembly that includes: a first substrate comprising glass and at least one inductor, the first substrate having a first side and an opposing second side; a second substrate coupled to the first side of the first substrate; and a plurality of integrated circuit (IC) dies. A first subset of the plurality of IC dies is directly coupled to the second side of the first substrate, a second subset of the plurality of IC dies is directly coupled to the second substrate adjacent to the first substrate, and a third subset of the plurality of IC dies is embedded in the second substrate between the first substrate and the second subset of the plurality of IC dies.